Micro-machining technology not only has high requirements for equipment and processing conditions, but also has high requirements for processing capabilities. In addition, some unconventional micro-nano device processing has been monopolized by foreign countries for a long time, resulting in the development of related industries has been controlled by others. Based on breaking the foreign technology blockade and realizing domestic technological innovation, the existing equipment and processing conditions can meet the customization needs of DOE, GPOE, ROE and MLA products. The following micro-nano devices can be processed according to customer requirements and the above process route: ring optical shaper, vortex Waveplate, homogenizer, micro-Lens, Laser diffuser, liquid crystal components, super-structured surface, etc.

GPOE Class Custom Product Overview

GOPE-like custom devices use femtosecond Laser to fabricate nanostructures with birefringent properties in quartz. Manipulation of the birefringence can be achieved by controlling the direct write parameters, in particular the polarization azimuth angle of the direct write beam.

Main application scenarios

· high threshold ring optical shaper, high threshold point ring optical shaper, high threshold adjustable point ring optical shaper

· high threshold vortex Waveplate, high threshold perfect vortex Waveplate

· high threshold flat top optical shaper, high threshold focus flat top optical shaper

Product Features

· High transmittance: the substrate is made of quartz with high transmittance. In the Near Infrared (NIR) band, the uncoated transmittance can reach 90%, and the coated transmittance can reach 99%

· Wide applicable band: UV(355nm) band/visible band/Near Infrared (NIR) band

· Strong customization ability: the size of the structure area can be customized; The device type can be customized, including S-Waveplate, flat cone Lens, perfect vortex light generator and other devices

· High damage threshold: extremely high damage threshold of up to 70J / cm²(@ 1064nm,6ns)

· High conversion efficiency: the conversion efficiency can reach 94%

· Easy integration: quartz substrates of different shapes and sizes can be selected to make devices according to integration requirements